Sensor

专利摘要:
A sensor 100 configured comprising a substrate holding part 5 holding an electronic substrate 51 inside it, a sensor cable 11 extending from the electronic substrate 51 through the inside of the substrate holding part 5 toward a sensor head 1, and a holding member 7 elastically deforming to hold the sensor cable 11 inside of the substrate holding part 5. By configuring the sensor 100 in this way, it is possible to suppress malfunctions when attaching the sensor 100 to the sensor mount of a shipboard internal combustion engine etc. where extremely large acceleration vibration occurs.
公开号:DK201870659A1
申请号:DKP201870659
申请日:2016-09-29
公开日:2018-12-17
发明作者:Yoshida Hiroyuki；Shoji Kazuichi；Iwamoto Hironori
申请人:Kengo TOMONARI；Applied Electronics Corporation；
IPC主号:

专利说明:

DESCRIPTION
Title of Invention: Sensor
Technical Field [0001]
The present invention relates to a sensor. Background Art [0002]
PLT 1 discloses a gap sensor used as a conventional sensor in an internal combustion engine for vehicular use and detecting an actual valve lift amount of that internal combustion engine. Citation List Patent Literature [0003]
PLT 1: Japanese Patent Publication No. 2016-44588A Summary of Invention Technical Problem [0004]
However, it was learned that if for example attaching the above-mentioned conventional sensor to a sensor mount which is subject to extremely large acceleration vibration or shock such as a shipboard internal combustion engine, the cable at the inside of the sensor or the electronic substrate etc. are liable to be damaged and the sensor is liable to malfunction.
[0005]
The present invention was made focusing on such a problem and has as its object to provide a sensor resistant to malfunction even if attached to a sensor mount subject to extremely large acceleration vibration or shock such as a shipboard internal combustion engine. Solution to Problem [0006]
To solve this problem, the sensor according to one aspect of the present invention is provided with a
DK 2018 70659 A1
- 2 substrate holding part holding an electronic substrate inside it, a sensor cable extending from the electronic substrate through the inside of the substrate holding part toward a sensor head, and a holding member elastically deforming to hold the sensor cable inside of the substrate holding part. Advantageous Effects of Invention [0007]
According to the sensor according to this aspect of the present invention, it is possible to suppress malfunctions when attached to a sensor mount subject to extremely large acceleration vibration or shock such as a shipboard internal combustion engine. Brief Description of Drawings [0008] [FIG. 1] FIG. 1 is a schematic plan view of a sensor according to one embodiment of the present invention. [FIG. 2] FIG. 2 is a schematic front view of a sensor according to one embodiment of the present invention seen from a cable tube side. [FIG. 3] FIG. 3 is a schematic cross-sectional view of a substrate holding part of a sensor according to one embodiment of the present invention. [FIG. 4] FIG. 4 is a schematic disassembled perspective view of the inside of a substrate holding part of a sensor according to one embodiment of the present invention. [FIG. 5] FIG. 5 is a schematic cross-sectional view of a substrate holding part of a sensor according to a comparative example. Description of Embodiments [0009]
Below, referring to the drawings, an embodiment of the present invention will be explained in detail. Note, in the following explanation, similar components will be assigned the same reference numerals. [0010]
DK 2018 70659 A1
- 3 FIG. 1 is a schematic plan view of a sensor 100 according to one embodiment of the present invention. FIG. 2 is a schematic front view of the sensor 100 according to the present embodiment as seen from a cable tube 6 side. [0011]
The sensor 100 according to the present embodiment is one type of a so-called gap sensor of a noncontact type eddy current displacement sensor which converts the displacement until a metal substance to be measured (magnetic target or nonmagnetic target) to an electrical signal for output. As shown in FIG. 1 and FIG. 2, the sensor 100 is provided with a sensor head 1, sensor case 2, sensor flange 3, shock absorbing material 4, substrate holding part 5, and cable tube 6. [0012]
The sensor head 1 is the portion in which a coil generating a magnetic field by an AC excitation current is housed. If passing the metal substance being measured through the magnetic field which the coil generates, an eddy current is generated in the metal substance being measured so as to cancel out the magnetic field generated by the coil. The strength of the magnetic field which the coil generates changes depending on the eddy current generated at the metal substance being measured. As a result, the value of the current flowing through the coil changes. The sensor 100 according to the present embodiment detects the change in the voltage value due to the change in the value of the current flowing through this coil and thereby detects if the metal substance being measured passes by the front of the sensor head 1. [0013]
The sensor case 2 is the portion through the inside of which a sensor cable 11 (see FIG. 3) connecting the coil and the electronic substrate 51 (see FIG. 3) held in the substrate holding part 5 is run. [0014]
DK 2018 70659 A1
- 4 The sensor flange 3 is a flange shaped portion sticking out from the sensor case 2 to the outside in the radial direction for attaching the sensor 100 to for example a sensor mount of the internal combustion engine. As shown in FIG. 2, the sensor flange 3 is formed with a plurality of bolt insertion holes 31 in which bolts are inserted for attachment of the sensor 100.
[0015]
The shock absorbing material 4 is attached to the sensor mounting surface 32 of the sensor flange 3 and suppresses propagation of vibration or shock from the sensor mount to the sensor 100.
[0016]
The substrate holding part 5 is the portion for holding the electronic substrate 51 inside it. The electronic substrate 51 is fastened and attached to the inside of the substrate holding part 5 by for example bolts etc.
[0017]
The cable tube 6 is the portion bundling a power line and other lines to be connected to the electronic substrate 51.
[0018]
Here, it was learned that if attaching such a configuration of a sensor 100 to, for example, a sensor mount subject to extremely large acceleration vibration or shock such as a shipboard internal combustion engine, the vibration etc. would be liable to cause trouble such as electronic devices dropping off from the electronic substrate 51 held in the substrate holding part 5 or such as the sensor cable 11 inside the substrate holding part 5 contacting the electronic substrate 51 etc. and being damaged. Below, referring to FIG. 5, the reason why such trouble occurs will be explained.
[0019]
FIG. 5 is a schematic cross-sectional view of the substrate holding part 5 of the sensor 100 according to a
DK 2018 70659 A1
- 5 comparative example in which such trouble occurs. [0020]
At the time of the work for assembly of the sensor 100, the sensor cable 11 connecting the coil housed inside the sensor head 1 and the electronic substrate 51 extends from the sensor head 1 through the inside of the sensor case 2 in the state connected to the coil in advance and to the inside of the substrate holding part
5. When the electronic substrate 51 is attached to the inside of the substrate holding part 5, it is attached to the electronic substrate 51. Since this work is for connecting this sensor cable 11 and electronic substrate 51, the sensor cable 11 has to be extended up to the inside of the substrate holding part 5 in the state with a certain degree of extra margin given to the cable length. For this reason, as shown in FIG. 5, after the work for connecting the sensor cable 11 and the electronic substrate 51, the sensor cable 11 is not fastened at the inside of the substrate holding part 5 at the sensor head 1 side, but is held in a state able to freely move. Further, it was not known in what shape it was held inside the substrate holding part 5 at the sensor head 1 side.
[0021]
In this way, if the sensor mount at which the sensor 100 is attached is subject to large acceleration vibration or shock in the state where the sensor cable 11 is not fastened at the inside of the substrate holding part 5, the weight of the sensor cable 11 becomes a load mass, acceleration acts on the sensor cable 11 as well, and the sensor cable 11 is subject to a large load (force). As a result, the sensor cable 11 contacts the electronic devices on the electronic substrate 51 resulting in the electronic devices dropping off the electronic substrate 51 or the sensor cable 11 itself being damaged.
[0022]
DK 2018 70659 A1
- 6 Thus, in the present embodiment, it is made possible to hold the sensor cable 11 inside of the substrate holding part 5.
[0023]
FIG. 3 is a schematic cross-sectional view of the substrate holding part 5 of the sensor 100 according to the present embodiment. FIG. 4 is a schematic disassembled perspective view of the inside of the substrate holding part 5 of the sensor 100 according to the present embodiment.
[0024]
As shown in FIG. 3, the sensor 100 according to the present embodiment is provided with a holding member 7 elastically deforming to hold the sensor cable 11 at the inside of the substrate holding part 5 at the sensor head 1 side. In the present embodiment, as the holding member 7, easily elastically deforming continuous porous sponge rubber (sponge silicon) is used, but, for example, rubber with a rubber hardness of about 5 or less etc. may also be used.
[0025]
As shown in FIG. 4, the holding member 7 is provided with a through hole 71 at its center for passing the sensor cable 11. To enable the sensor cable 11 to be passed through the through hole 71 after the work for connecting the sensor cable 11 and the electronic substrate 51, a slit 72 is provided opening at the side surface of the holding member 7 and leading to the through hole 71.
[0026]
Further, as shown in FIG. 3 and FIG. 4, the holding member 7 is divided into a first holding member 7a at the electronic substrate 51 side and a second holding member 7b at the sensor head 1 side. After the work for connecting the sensor cable 11 and the electronic substrate 51, it is possible to grip the sensor cable 11, which is in the state not fastened at the inside of the
DK 2018 70659 A1
- 7 substrate holding part 5 but able to freely move, by the first holding member 7a and the second holding member 7b. The holding member 7 is configured by members which can easily elastically deform, so due to this, the parts of the first holding member 7a and second holding member 7b contacting the sensor cable 11 elastically deform and the weight of the sensor cable 11 can be supported by the first holding member 7a and second holding member 7b. For this reason, it is possible to reduce the load on the sensor cable 11 when a large acceleration vibration acts on the sensor mount and acceleration acts on the sensor cable 11 compared with the case of a comparative example with no holding member 7.
[0027]
As a result, it is possible to keep the sensor cable 11 from contacting the electronic devices of the electronic substrate 51 and electronic devices from dropping off from the electronic substrate 51 or the sensor cable 11 itself being damaged. Further, it is possible to prevent direct contact of the sensor cable 11 and the electronic devices etc., so it is possible to keep electronic devices from dropping off the electronic substrate 51 and the sensor cable 11 itself from being damaged.
[0028]
Further, the holding member 7 is higher in its axial direction height (thickness) h (mm) than the axial direction height H (mm) (see FIG. 3) of the substrate holding part 5 at the sensor head 1 side. Due to this, when inserting the holding member 7 inside of the substrate holding part 5, to prevent space from forming inside of the substrate holding part 5 at the sensor head 1 side, the entire inside of the bolding holding part 5 at the sensor head 1 side is filled by the holding member
7. For this reason, when large acceleration vibration occurs at the sensor mount and acceleration acts on the sensor cable 11, it is possible to reliably suppress
DK 2018 70659 A1
- 8 movement of the sensor cable 11, so it is possible to more effectively keep the sensor cable 11 from contacting the electronic devices of the electronic substrate 51 and the electronic devices from dropping off the electronic substrate 51 or the sensor cable 11 itself from being damaged.
[0029]
Note, as the method for holding the sensor cable 11 at the inside of the substrate holding part 5 at the sensor head 1 side, in addition to this, the method may be considered of performing the work for connecting the sensor cable 11 and electronic substrate 51, then filling silicone to the inside of the substrate holding part 5 at the sensor head 1 side. However, to fill silicone, the substrate holding part 5 has to be formed with a hole for filling the silicone and a hole for releasing the trapped air etc. Also, work of filling the silicone and work of releasing the trapped air become necessary. For this reason, the number of work steps ends up increasing. Further, it is not possible to check the inside of the substrate holding part 5 after filling it with silicone, so it is not possible to check for entrainment of air etc. For this reason, if changes in the external environment cause the temperature to change, the moisture in the sealed-in air is liable to condense inside of the substrate holding part 5 and the sensor 100 is liable to malfunction.
[0030]
As opposed to this, in the present embodiment, it is sufficient to just insert the holding member 7 elastically deformed to hold the sensor cable 11 inside of the substrate holding part 5 at the sensor head 1 side after the work of connecting the sensor cable 11 and electronic substrate 51, so it is possible to prevent malfunctions arising due to such filling of silicone.
[0031]
The sensor 100 according to the present embodiment
DK 2018 70659 A1
- 9 explained above is provided with a substrate holding part 5 holding an electronic substrate 51 inside it, a sensor cable 11 extending from the electronic substrate 51 through the inside of the substrate holding part 5 toward the sensor head 1, and a holding member 7 elastically deforming to hold the sensor cable 11 inside of the substrate holding part 5.
[0032]
Due to this, at the inside of the substrate holding part 5, it is possible to use the elastically deforming holding member 7 to hold the sensor cable 11 and support the weight of the sensor cable 11. For this reason, it is possible to suppress the load acting on the sensor cable 11 when large acceleration vibration or shock occurs at the sensor mount and acceleration acts on the sensor cable 11 and keep the sensor cable 11 from contacting the electronic devices on the electronic substrate 51 and causing the electronic devices to drop off the electronic substrate 51 or causing the sensor cable 11 itself to be damaged.
[0033]
Further, in the present embodiment, the holding member 7 is provided with the first holding member 7a and second holding member 7b. The first holding member 7a and the second holding member 7b grip the sensor cable 11 to thereby hold the sensor cable 11.
[0034]
In this way, after the work of connecting the sensor cable 11 and the electronic substrate 51, it is possible to grip the sensor cable 11, in a state not fastened at the inside of the substrate holding part 5, but able to freely move, between the first holding member 7a and the second holding member 7b and thereby more reliably hold the sensor cable 11 by the elastically deforming holding member 7 and support the weight of the sensor cable 11. Further, it is possible to prevent direct contact of the sensor cable 11 and the electronic devices etc., so it is
DK 2018 70659 A1
- ίο possible to keep electronic devices from dropping off the electronic substrate 51 and the sensor cable 11 itself from being damaged.
[0035]
Further, in the present embodiment, the holding member 7 is arranged at the inside of the substrate holding part 5 at the side where the sensor cable 11 is arranged so as to fill the space at the inside of the substrate holding part 5 at the side where the sensor cable 11 is arranged.
[0036]
Due to this, when large acceleration vibration or shock occurs at the sensor mount and acceleration acts on the sensor cable 11, movement of the sensor cable 11 can be reliably suppressed, so it is possible to more effectively keep the sensor cable 11 from contacting the electronic devices of the electronic substrate 51 and the electronic devices from dropping off the electronic substrate 51 or the sensor cable 11 itself from being damaged due to vibration or shock.
[0037]
Further, the sensor 100 according to the present embodiment is further provided with a sensor flange 3 (flange for sensor attachment use) and a shock absorbing material 4 provided at the sensor mounting surface 32 of the sensor flange 3.
[0038]
Due to this, it is possible to suppress propagation of vibration or shock from the sensor mount to the sensor 100, so it is possible to more effectively keep electronic devices from dropping off the electronic substrate 51 or the sensor cable 11 itself from being damaged due to vibration or shock.
[0039]
Above, an embodiment of the present invention was explained, but the embodiment only shows some of the examples of application of the present invention and does
DK 2018 70659 A1
- ii not limit the technical scope of the present invention to the specific configuration of the above embodiment.
[0040]
For example, in the above embodiment, as one example of the sensor 100, one type of gap sensor of a noncontact type eddy current displacement sensor was illustrated for the explanation, but the sensor 100 is not limited to this and for example may be a magnetic sensor or other sensor . Reference Signs List [0041]
I. sensor head
3. sensor flange (flange for sensor attachment use)
4. shock absorbing material
II. sensor cable
5. substrate holding part
7. holding member
7a. first holding member 7b. second holding member 51. electronic substrate 100. sensor
DK 2018 70659 A1

权利要求:
Claims (4)
[1] CLAIMS Claim 1.
A sensor comprising: a substrate holding part holding an electronic substrate inside it;
a sensor cable extending from the electronic substrate through the inside of the substrate holding part toward a sensor head; and a holding member elastically deforming to hold the sensor cable inside of the substrate holding part.
[2] Claim 2.
The sensor according to claim 1, wherein the holding member is comprised of a first holding member and a second holding member, the first holding member and the second holding member gripping the sensor cable to hold the sensor cable.
[3] Claim 3.
The sensor according to claim 1 or claim 2, wherein the holding member is arranged at the inside of the substrate holding part at the side where the sensor cable is arranged so as to fill the space at the inside of the substrate holding part at the side where the sensor cable is arranged.
[4] Claim 4.
The sensor according to any one of claim 1 to claim 3, further comprising: a flange for sensor attachment use and a shock absorbing material provided at a sensor mounting surface of the flange for sensor attachment use.
DK 2018 70659 A1
P160557W0

100

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法律状态:
2018-12-17| PAT| Application published|Effective date: 20181004 |

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2020-09-11| PHB| Application deemed withdrawn due to non-payment or other reasons|Effective date: 20200825 |

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PCT/JP2016/078905|WO2018061156A1|2016-09-29|2016-09-29|Sensor|

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